Precious Metal Business contents
Micro solder balls
With exceptional fatigue resistance and mountability, our micro solder balls can be used with a range of package types, from BGA and CSP to flip chip.
※These products are manufactured by an affiliate, Nippon Micrometal Corporation.
Product Information
Lead-free type
| Series | Principal components | Melting temperature (°C) | Patent No. |
|---|---|---|---|
| LF60 | Au80/Sn20 | 278 | ー |
| LF35 | Sn/Ag1.2/Cu0.5/Ni0.05 | 217～227 | JP4152596 |
| LF210N | Sn / Ag2.0 / Cul.0 / Ni0.05 | 217～227 | JP 3796181 JP 4391276 |
| LF45 | Sn/Ag3.0/Cu0.5 | 217～219 | JP 3027441 US 5527628 |
Dimensional tolerances
| Ball diameter (μm) | Tolerance (μm) |
|---|---|
| D ＜100 | ±3 |
| 100≦ D ＜150 | ±5 |
| 150≦ D ≦400 | ±10 |
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Life cycle managementPrecious metal life cycle management proposals
We provide solutions for life cycle management, from processing to use and disposal, with the goal of reducing environmental impacts and effectively using precious metals.
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