Plating Processes
We provide a range of support, including pre-treatment prior to customers’ purchases of plating liquid; consideration of overall processes including substrate plating and post-treatment; and liquid management, liquid analysis, and defect countermeasures following customers’ purchase of plating liquid.
Characteristics of our plating liquid
- Our plating liquids are easy to manage, have a long service life, and boast high reliability thanks to a broad process window and high resistance to impurities.
- Since they can be used at low precious metal concentrations, both initial make-up costs and drag-out losses can be reduced.
Don’t hesitate to get in touch with one of our process engineers right away concerning your precious metal surface treatment chemical needs and requirements.
Unparalleled service and support
We subject our precious metal compounds to continual compliance testing to ensure they qualify for use in replenishing a variety of commercially available plating stock liquids and thereby broaden the range of choice available in precious metal compounds (replenishment salts) for use in replenishing plating tanks.
We’re also working actively to reduce our environmental footprint, and we manufacture EcoPGC™ potassium dicyanoaurate that has received outside certification.
Product Information
We can supply precious metal surface treatment chemicals that meet the rigorous requirements of electronic device manufacturing.
Precious metal plating chemicals
Gold plating chemicals (Au)
These products feature a broad process window, low gold concentration, and long service life. Reduced gold use translates directly into lower total costs.
Electrolytic gold plating
| Product | Type | Characteristics |
|---|---|---|
| Auru Sigma TM | Pure gold plating liquid | Excellent, uniform electrocoating properties; broad luster range at low gold concentrations |
| Auru Sigma F | Pure gold flash plating liquid | Excellent solder wettability; thin-coat pure gold plating; no toxic thallium compounds; excellent, uniform electrocoating properties |
| Auru Sigma CO-EX | Hard gold-cobalt plating liquid | Fine, smooth plating coat; excellent, uniform electrocoating properties; low gold concentration; can be used at high current densities |
| Auru Sigma NI | Hard gold-nickel plating liquid | Fine, smooth plating coat; same high contact resistance as hard gold-cobalt plating; can be used to produce advanced (300 Hv) coats |
| Auru Sigma ST | Gold strike plating liquid | Excellent adhesion properties; can be used with high current densities |
| Auru Sigma MU | Non-cyanide pure gold plating liquid | Uniform electrocoating properties; excellent stability; ideal for wire formation in semiconductors |
Palladium plating chemicals (Pd)
Ideal for increasing heat resistance of electronic components and reducing precious metal use High liquid stability; long service life; easy liquid management
Electrolytic palladium plating
| Product | Type | Characteristics |
|---|---|---|
| Palla Sigma LN | Pure palladium plating liquid | Neutral/low-ammonia/low-palladium concentration; resistant to cyanide contamination; easy liquid management; fine, smooth coat properties, even for thin coatings; excellent solder wettability |
| Palla Sigma UF | Palladium plating liquid | Neutral/low-ammonia/low-palladium concentration; excellent heat resistance and solder wettability with super-thin coatings |
| Palla Sigma NI | Palladium-nickel plating liquid | Neutral/low-ammonia; resistant to cyanide contamination; easy liquid management; can form coatings at stable alloy ratios |
| Palla Sigma NI-TF | Palladium-nickel plating liquid | Neutral/low-ammonia; can create coatings on the order of dozens of μm with low stress; MEMS and electroforming applications |
| Palla Sigma CO | Palladium-cobalt plating liquid | Neutral/low-ammonia; resistant to cyanide contamination; can create low-contact-resistance, high-hardness coatings; plunger applications |
Precious metal replenishment chemicals
| Product | Type | Characteristics | |
|---|---|---|---|
| Au | Auru Assist | Non-cyanide type gold plating replenishment liquid | High purity, non-cyanide type |
| Pd | Palla Assist | Palladium plating replenishment liquid | High purity, long-term stability |
Please contact us for more information about plating liquids or alloy plating products not listed here.
For precious metal surface treatment chemical documentation, please see our documentation page.
Other surface treatment chemicals
Nickel plating chemicals (Ni)
Electrolytic nickel plating chemicals
| Product | Type | Characteristics |
|---|---|---|
| Nick Sigma Additive WE | Electrolytic nickel plating additive | Improved thin-coat properties and heat resistance for Ni/Pd/Au plating processes |
| Nick Sigma CO | Electrolytic nickel-cobalt plating liquid | Excellent corrosion and heat resistance |
Precious metal replenishment salts
Palla Assist〔Pd(NH3)4〕Cl2
(Tetraamminepalladium chloride)
Palla Assist is a high-purity replenishment liquid for palladium plating applications.
It can be used with a broad range of palladium plating applications, including semiconductor lead frames, electronic components, and decorative products.
Quality
| Chemical name | Specifications | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Pd content (g/L) |
pH | Impurity elements (ppm) | |||||||||
| Au | Ag | Pt | Fe | Ni | Cr | Cu | Co | Pd | |||
| Tetraamminepalladium (Ⅱ) chloride | 90≦Pd≦110 | 8.0≦pH≦10.0 | ≦10 | ≦10 | ≦10 | ≦5 | ≦5 | ≦5 | ≦5 | ≦5 | ≦5 |
Test method
| Tested property | Test method |
|---|---|
| Weight | Weighed on specified measuring instrument |
| Water solubility | Visual judgment after dissolution in water |
| Loss on drying | Measurement of weight change after drying for 2 hours at 110°C |
| Au content | Weight method |
| Impurity elements | ICP emission spectral analysis |
Au plating replenishment chemicals
Potassium dicyanoaurate K〔Au(CN)2〕
Potassium dicyanoaurate is a high-purity replenishment chemical for gold plating applications.
It can be used with a broad range of gold plating applications, including semiconductor lead frames, electronic components, and decorative products.
Quality
| Chemical name | Specifications | |||||
|---|---|---|---|---|---|---|
| Water solubility | Loss on drying | Au content | Impurity elements (ppm) | |||
| Ag | Cu | Fe | ||||
| Potassium dicyanoaurate(Ⅰ) | Colorless and transparent | ≦0.2％ | 68.20％≦ | ≦20 | ≦10 | ≦10 |
Test method
| Tested property | Test method |
|---|---|
| Weight | Weighed on specified measuring instrument |
| Water solubility | Visual judgment after dissolution in water |
| Loss on drying | Measurement of weight change after drying for 2 hours at 110°C |
| Au content | Weight method |
| Impurity elements | ICP emission spectral analysis |
Au plating replenishment liquids
Sodium disulfitoaurate Na3［Au(SO3)2］
Sodium disulfitoaurate is a high-purity replenishment chemical for non-cyanide gold plating applications.
It can be used with a broad range of non-cyanide gold plating applications, including semiconductor lead frames, electronic components, and decorative products.
Quality
| Chemical name | Specifications | |||||
|---|---|---|---|---|---|---|
| Au content | Impurity elements (ppm) | |||||
| Ag | Pt | Pd | Cu | Fe | ||
| Sodium disulfitoaurate (Ⅰ) | 50g/ℓ 100g/ℓ |
≦５ | ≦５ | ≦５ | ≦５ | ≦５ |
Test method
| Tested property | Test method |
|---|---|
| Weight | Weighed on specified measuring instrument |
| Au content | Weight method |
| Impurity elements | ICP emission spectral analysis |
Life cycle managementPrecious metal life cycle management proposals
We provide solutions for life cycle management, from processing to use and disposal, with the goal of reducing environmental impacts and effectively using precious metals.
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