Bonding wire
Bonding wire is a bonding material used to carry electrical signals from semiconductor elements to packages.
We supply primary copper and silver bonding wire and micro solder balls.
※These products are manufactured by an affiliate, Nippon Micrometal Corporation.
Product Information
Copper bonding wire (EX)
This copper bonding wire can drive significant cost savings when used as a substitute for expensive gold bonding wire. Conventional copper bonding wire suffers from the issues of reduced secondary bondability, lower workability, and shorter service life due to oxidation of the wire surface.
Silver bonding wire (GX)
This silver bonding wire can drive significant cost savings when used as a substitute for expensive gold bonding wire. Conventional silver bonding wire suffers from issues with electrical characteristics and reliability. GX2 is a revolutionary wire product that resolves those problems. The product is being used in 3D memory devices, and it can also be used in next-generation high-speed devices.
Gold bonding wire
These products push the envelope of bonding technologies, including with smaller wire diameters, longer spans, and finer pitches.
Aluminum bonding wire
Compared to conventional aluminum bonding wire, these products broaden the envelope of bonding conditions within which aluminum bonding wire can be used.
【Characteristics】
High corrosion resistance and broad process window
List of products
Copper bonding wire (EX)
| Item | EX1R | EX1F | EX1p | EX1 |
|---|---|---|---|---|
| Copper Core Material | 2N | 2N~3N | 4N | |
| HAST Reliability | ◎ | ◎ | ○ | △ |
| HTS >= 175 degC | ◎ | - | - | - |
| Distribution | ◎ | ◎ | ○ | ○ |
| Stitch Strength | ◎ | ◎ | ◎ | ○ |
| 2nd Peeling | ◎ | ◎ | ◎ | ○ |
| Pad Damage/Metal Peeling | ○ | ○ | ○ | ○ |
| Lifetime in air | ◎ | ◎ | ◎ | ◎ |
◎better ○good △Fair
Silver bonding wire (GX)
| Item | GX2 | Conventional Ag wire |
|---|---|---|
| Resistivity | ◎ | △ |
| HAST Reliability | ◎ | ○ |
| Leaning Property | ◎ | ◎ |
| Snaking Property | ◎ | ◎ |
| Pad Damage/Metal Peeling | ◎ | ◎ |
| Stitch Strength | ◎ | ◎ |
◎better ○good △Fair
Gold bonding wire
4N-type wire (Au purity: 99.99% or greater)
| AT series | These products are suitable for use with longer spans, finer pitches, and smaller wire diameters. ・Wire span： 7 mm ・Loop height：90μm ・Pad pitch：60μm ・Breaking strength（Φ25μm）：147mN（15g） |
|---|---|
| T series | These products offer a high level of versatility and can be used in long spans, trapezoidal short spans for BGAs, and other applications. |
Alloy-type wire (Au purity: 99% or greater)
| G series | These products offer long-term bonding reliability while allowing bonding at 2N-type wire parameters. |
|---|
◎better ○good △Fair
Aluminum bonding wire
| Item | NL1 | 4N-Al |
|---|---|---|
| Purity | 3N | 4N |
| Corrosion resistance | ○ | △ |
| Bondability | ○ | － |
| Diameter (um) | 125 ~ 500 | － |
◎better ○good △Fair
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